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Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MOBILE BODY
Document Type and Number:
WIPO Patent Application WO/2022/049660
Kind Code:
A1
Abstract:
The present disclosure was conceived to solve a problem, and the purpose of the disclosure is to provide a semiconductor device that enables a reduction in costs. A semiconductor device according to the present disclosure comprises: a base plate; an insulating substrate provided on the base plate; a semiconductor chip provided on the insulating substrate; a first resin case and a second resin case that are attached to the base plate so as to enclose the insulating substrate and the semiconductor chip, and that are mated to each other; and an encapsulant that encapsulates the insulating substrate and the semiconductor chip. The first resin case and the second resin case are configured from resin materials that have different comparative tracking indices.

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Inventors:
HIRONAKA YOICHI (JP)
YANAGIMOTO TATSUNORI (JP)
Application Number:
PCT/JP2020/033217
Publication Date:
March 10, 2022
Filing Date:
September 02, 2020
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
JP2018046158A2018-03-22
JP2012129344A2012-07-05
JP2001177053A2001-06-29
JP2019071392A2019-05-09
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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