Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/140503
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an easily replaceable semiconductor device, and a semiconductor system using the semiconductor device. This semiconductor device is provided with: a semiconductor chip (2); a cooling apparatus (4), which cools the semiconductor chip (2); a housing (12), which houses the semiconductor chip (2) and the cooling apparatus (4); a transfer resin (11), which encapsulates the semiconductor chip (2) and the cooling apparatus (4) in the housing (12); electrodes (10) connected to the semiconductor chip (2); and a joining pipe (5), which is attached to the cooling apparatus (4), and which introduces a cooling medium flow into and from the cooling apparatus (4). The electrodes (10) and the pipe (5) are formed to protrude in the substantially same direction from the same surface of the housing (12).
Inventors:
MIYAMOTO NOBORU (JP)
SHIRASAWA TAKAAKI (JP)
SHIRASAWA TAKAAKI (JP)
Application Number:
PCT/JP2012/057035
Publication Date:
September 26, 2013
Filing Date:
March 19, 2012
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MIYAMOTO NOBORU (JP)
SHIRASAWA TAKAAKI (JP)
MIYAMOTO NOBORU (JP)
SHIRASAWA TAKAAKI (JP)
International Classes:
H01L23/473
Foreign References:
| JP2005072411A | 2005-03-17 | |||
| JPH021960A | 1990-01-08 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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