Title:
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, SENSOR CONTROL DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/026786
Kind Code:
A1
Abstract:
Provided is a semiconductor device which includes, on a substrate, at least a first region in which two or more semiconductor elements are arranged, and a second region in which one or more semiconductor elements are arranged, wherein each of the semiconductor elements of the first region and the second region has, on the substrate, a source electrode, a drain electrode, a gate electrode, a semiconductor layer of the first region that contacts the source electrode and the drain electrode, and a gate insulating layer that insulates the semiconductor layer and the gate electrode. Each semiconductor element of the first region further has, on the substrate, a second insulating layer that contacts the semiconductor layer at a position different from that of the gate insulating layer. The semiconductor elements of the first region have electrical conductivity that is different from the electrical conductivity of the semiconductor elements of the second region due to the second insulating layer. The insulating layer is continuously arranged over two or more of the semiconductor elements of the first region.
Inventors:
NOGUCHI KENTA (JP)
WAKITA JUNJI (JP)
HORII SHINJI (JP)
YASUGI SHINICHI (JP)
WAKITA JUNJI (JP)
HORII SHINJI (JP)
YASUGI SHINICHI (JP)
Application Number:
PCT/JP2019/027883
Publication Date:
February 06, 2020
Filing Date:
July 16, 2019
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
H01L21/336; H01L29/786; H01L51/05; H01L51/30
Domestic Patent References:
| WO2017212972A1 | 2017-12-14 | |||
| WO2011037102A1 | 2011-03-31 | |||
| WO2005057665A1 | 2005-06-23 |
Foreign References:
| JP2010018696A | 2010-01-28 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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