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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/024941
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device which comprises a semiconductor chip (61) including a power semiconductor element using a wide band gap semiconductor, bases (62, 63), first and second intermediate members (65, 68a), a heat transferring member (66), a heat dissipating fin (67), and a sealing material (68) for sealing the semiconductor chip (61), the first and second intermediate members (65, 68a) and the heat transferring member (66). End portions of the bases (62, 63) are respectively formed as external connection terminals (62a, 63a). The second intermediate member (68a) is made of a material having a lower thermal conductivity than the first intermediate member (65), and has a larger contact area with the semiconductor chip (61) than the first intermediate member (65).

Inventors:
KITABATAKE MAKOTO
KUSUMOTO OSAMU
UCHIDA MASAO
TAKAHASHI KUNIMASA
YAMASHITA KENYA
Application Number:
PCT/JP2004/013263
Publication Date:
March 17, 2005
Filing Date:
September 06, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
KITABATAKE MAKOTO
KUSUMOTO OSAMU
UCHIDA MASAO
TAKAHASHI KUNIMASA
YAMASHITA KENYA
International Classes:
H01L23/367; H01L23/433; (IPC1-7): H01L23/36; H01L25/04
Foreign References:
JPH05121603A1993-05-18
JP2002368121A2002-12-20
JP2002033445A2002-01-31
JP2003017658A2003-01-17
JP2001156225A2001-06-08
JP2004214368A2004-07-29
JP2004140068A2004-05-13
DE10058446A12001-05-31
Other References:
JOSEF LUTZ, STAND UND ENTWICKLUNGSTENDENZEN BEI SCHNELLEN DIODEN, March 2002 (2002-03-01)
Attorney, Agent or Firm:
Maeda, Hiroshi (5-7 Hommachi 2-chome, Chuo-k, Osaka-shi Osaka 53, JP)
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