SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2008/018332

A1

A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.

TAKANO FUMITOMO (JP)
WATANABE SHINYA (JP)
AIBA TSUKASA (JP)
NAKASHIMA JOJI (JP)
OTSUKA HIROSHI (JP)

PCT/JP2007/065035

February 14, 2008

July 25, 2007

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HONDA MOTOR CO LTD (JP)
TAKANO FUMITOMO (JP)
WATANABE SHINYA (JP)
AIBA TSUKASA (JP)
NAKASHIMA JOJI (JP)
OTSUKA HIROSHI (JP)

H01L25/18; H01L25/07

JP2004140068A	2004-05-13
JP2006310571A	2006-11-09
JP2002026251A	2002-01-25

See also references of EP 2051301A4

SHIMODA, Yo-ichiro et al. (1-12 Akasaka 1-chom, Minato-ku Tokyo 52, JP)

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