Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/108522
Kind Code:
A1
Abstract:
A semiconductor element (6), which is provided with control electrodes and main electrodes on both the main surfaces, respectively, is sandwiched between two metal base plates (1, 11), which are respectively disposed on both the main surface sides of the semiconductor element (6). Insulating substrates (3, 13) respectively bonded to the metal base plates (1, 11) are respectively provided with first metal layers (4a, 14a) and second metal layers (4b, 14b). The first and the second metal layers (4a, 4b) are respectively bonded to the control electrode and the main electrode on one of the main surfaces of the semiconductor element (6) with first and second solder layers (5a, 5b) therebetween. The first and the second metal layers (14a, 14b) are respectively bonded to the control electrode and the main electrode on the other main surface of the semiconductor element (6) with first and second solder layers (15a, 15b) therebetween. The first and the second metal layers are respectively connected to external connecting terminals (8a, 8b, 9a, 9b). Consequently, the semiconductor element (6), which is provided with the electrodes on both the main surfaces, respectively, can be mounted with high positional accuracy, and excellent electrical connection can be ensured.
Inventors:
YOSHIKAWA KOH (JP)
IKEDA YOSHINARI (JP)
IKEDA YOSHINARI (JP)
Application Number:
PCT/JP2012/082258
Publication Date:
July 25, 2013
Filing Date:
December 12, 2012
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L21/60; H01L29/78
Foreign References:
| JP2008060531A | 2008-03-13 | |||
| JP2003218306A | 2003-07-31 |
Attorney, Agent or Firm:
SAKAI, AKINORI (JP)
Akinori Sakai (JP)
Akinori Sakai (JP)
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Claims: