SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/207939

Kind Code:

A1

Abstract:

An embodiment of this disclosure is a configuration that is provided with a coupling element connected between a signal input circuit and signal output circuit and in which the signal input circuit, signal output circuit, and coupling element are packaged by being formed on a semiconductor chip. This configuration comprises an inspection output circuit for outputting an inspection signal from the signal input circuit to the outside without the signal passing through the coupling element and/or an inspection input circuit for inputting an inspection signal into the signal output circuit from the outside without the signal passing through the coupling element.

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Inventors:

HASEGAWA JUNICHI (JP)
MICHISHITA YUSUKE (JP)

Application Number:

PCT/JP2019/007053

Publication Date:

October 31, 2019

Filing Date:

February 25, 2019

Export Citation:

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Assignee:

DENSO CORP (JP)

International Classes:

G01R31/28; H01L21/822; H01L27/04

Domestic Patent References:

WO2010119625A1	2010-10-21
WO2018020713A1	2018-02-01

Foreign References:

JP2017188903A	2017-10-12
JP2010243218A	2010-10-28
JP2003344508A	2003-12-03