Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/059285
Kind Code:
A1
Abstract:
The present invention enables increased usage of a semiconductor chip mounting area on a ceramic circuit board while suppressing a reduction in gate response speed. An arm part (1, 1a) includes: semiconductor chips (2, 3); circuit patterns (4, 5); and control wiring (6a). The semiconductor chips (2, 3) comprise, on any side section of the front surface thereof, control electrodes (2a, 3a), respectively. The circuit pattern (4) has a rectangular shape in plan view and has the semiconductor chips (2, 3) disposed thereon such that the side sections of the semiconductor chips (2, 3) are arranged in a line and such that the control electrodes (2a, 3a) are arranged in a line. The circuit pattern (5) is arranged in a line with respect to the control electrodes (2a, 3a). Furthermore, the control wiring (6a) electrically connects the control electrodes (2a, 3a) to the circuit pattern (5).
Inventors:
KAKEFU MITSUHIRO (JP)
ICHIKAWA HIROAKI (JP)
ICHIKAWA HIROAKI (JP)
Application Number:
PCT/JP2019/028851
Publication Date:
March 26, 2020
Filing Date:
July 23, 2019
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L25/18; H01L29/739; H01L29/78
Domestic Patent References:
| WO2017056176A1 | 2017-04-06 | |||
| WO2017159029A1 | 2017-09-21 |
Foreign References:
| JP2009164325A | 2009-07-23 | |||
| JP2017168792A | 2017-09-21 |
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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