SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2020/166283

A1

This semiconductor device is provided with: a substrate; a first region, a second region positioned away from the first region, and a third region positioned between the first region and the second region; a first joint portion and fourth joint portion joined to the first region; a second joint portion and fifth joint portion joined to a second chip; a third joint portion and sixth joint portion joined to a first chip; a first wire including the first to third joint portions; and a second wire including the fourth to sixth joint portions and disposed adjacent to the first wire. A first imaginary straight line passing through the center of mass of the first joint portion and the center of mass of the second joint portion is parallel to a second imaginary straight line passing through the center of mass of the fourth joint portion and the center of mass of the fifth joint portion, the distance between the second imaginary straight line and the center of mass of the third joint portion is larger than the distance between the second imaginary straight line and the center of mass of the second joint portion, and the relation 0<θ