Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241238
Kind Code:
A1
Abstract:
A semiconductor device A1 according to the present disclosure is provided with: a support member 2; a metal member 30 which has a main surface 301 and a back surface 302, while being bonded to the support member 2 so that the back surface 302 faces the support member 2, said main surface 301 and back surface 302 being at a distance from each other in the z direction; a second bonding layer 42 which bonds the support member 2 and the metal member 30 to each other; a semiconductor element 10 which faces the main surface 301 and is bonded to the metal member 30; and a sealing member 7 which covers the support member 2, the metal member 30, the second bonding layer 42 and the semiconductor element 10. The metal member 30 comprises a first metal body 31 that is formed of a first metal material and a second metal body 32 that is formed of a second metal material; and there is a boundary between the first metal body 31 and the second metal body 32. The linear expansion coefficient of the second metal material is lower than the linear expansion coefficient of the first metal material. The present invention is able to provide a semiconductor device having improved reliability by relaxing the thermal stress during the time when a semiconductor element generates heat.
Inventors:
INOUE KAITO (JP)
KIMURA AKIHIRO (JP)
KIMURA AKIHIRO (JP)
Application Number:
PCT/JP2020/018953
Publication Date:
December 03, 2020
Filing Date:
May 12, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/14; H01L25/07; H01L25/18
Foreign References:
| JP2013149912A | 2013-08-01 | |||
| JP2019012767A | 2019-01-24 | |||
| JP2019029631A | 2019-02-21 | |||
| JP2007115731A | 2007-05-10 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF: