Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/145206
Kind Code:
A1
Abstract:
This semiconductor device is provided with a circuit portion, a bus bar, and first to third bonding members having electrical conductivity. The circuit portion includes a mounting substrate, and first to third objects to be connected provided on the mounting substrate. The bus bar includes a first connecting portion, a second connecting portion, a third connecting portion, and a linking portion coupling the first connecting portion, the second connecting portion, and the third connecting portion to each other. The first connecting portion is positioned between the second connecting portion and the third connecting portion. The distance from the mounting substrate to the first connecting portion is greater than the distance from the mounting substrate to the second connecting portion, and the distance from the mounting substrate to the first connecting portion is greater than the distance from the mounting substrate to the third connecting portion.
Inventors:
OKASAKA SHOTA
MATSUBAYASHI RYO
MATSUBAYASHI RYO
Application Number:
PCT/JP2020/048900
Publication Date:
July 22, 2021
Filing Date:
December 25, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/18
Domestic Patent References:
| WO2018021322A1 | 2018-02-01 |
Foreign References:
| JP2010245212A | 2010-10-28 | |||
| JP2018186244A | 2018-11-22 | |||
| JP2015050340A | 2015-03-16 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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