Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/200406
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device in which the flatness of a glass substrate is maintained and an end part of the glass substrate is protected sufficiently. [Solution] A semiconductor device according to an aspect of the present disclosure is provided with: a glass substrate having a first surface, a second surface opposite the first surface, and a first side surface disposed between the first surface and the second surface; wiring provided on the first and the second surfaces; a first insulating film covering the first surface; a second insulating film covering the second surface; and a third insulating film covering the first side surface and continuous with at least one of the first and the second insulating films.
Inventors:
TANAKA YUTO (JP)
OKA SHUICHI (JP)
MITARAI SHUN (JP)
ADACHI KIWAMU (JP)
IGARASHI TAKAHIRO (JP)
OHTORII HIIZU (JP)
KAKOIYAMA NAOKI (JP)
SEKI KOUSUKE (JP)
SHIGETA HIROYUKI (JP)
OKA SHUICHI (JP)
MITARAI SHUN (JP)
ADACHI KIWAMU (JP)
IGARASHI TAKAHIRO (JP)
OHTORII HIIZU (JP)
KAKOIYAMA NAOKI (JP)
SEKI KOUSUKE (JP)
SHIGETA HIROYUKI (JP)
Application Number:
PCT/JP2021/012062
Publication Date:
October 07, 2021
Filing Date:
March 23, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; H01L23/15; H01L27/146; H05K3/46
Domestic Patent References:
| WO2019073801A1 | 2019-04-18 | |||
| WO2001082367A1 | 2001-11-01 | |||
| WO2017086222A1 | 2017-05-26 | |||
| WO2017090223A1 | 2017-06-01 | |||
| WO2020003732A1 | 2020-01-02 |
Foreign References:
| JP2017084843A | 2017-05-18 | |||
| JP2011258654A | 2011-12-22 | |||
| JP6201663B2 | 2017-09-27 | |||
| JP6369436B2 | 2018-08-08 | |||
| JP2017224672A | 2017-12-21 | |||
| JP2017084843A | 2017-05-18 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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