Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/210402
Kind Code:
A1
Abstract:
This semiconductor device comprises a substrate, an electrically conductive portion, a sealing resin, a plurality of semiconductor chips, and a plurality of temperature detection elements. The substrate has a substrate main surface and a substrate back surface facing away from each other in the thickness direction. The electrically conductive portion is formed on the substrate main surface. The sealing resin covers at least a part of the substrate. Further, the sealing resin covers the electrically conductive portion entirely. The plurality of semiconductor chips are each disposed on the substrate main surface. The plurality of temperature detection elements are each disposed on the substrate main surface. The number of the plurality of temperature detection elements is greater than or equal to the number of the plurality of semiconductor chips.
Inventors:
HAMA KENJI (JP)
ISHIMATSU YUJI (JP)
HARA HIDEO (JP)
ISHIMATSU YUJI (JP)
HARA HIDEO (JP)
Application Number:
PCT/JP2021/013848
Publication Date:
October 21, 2021
Filing Date:
March 31, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/34; H01L23/36; H01L23/58; H01L25/07; H01L25/18
Domestic Patent References:
| WO2013046824A1 | 2013-04-04 |
Foreign References:
| JP2018050433A | 2018-03-29 | |||
| JP2010056333A | 2010-03-11 | |||
| JP2013201325A | 2013-10-03 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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