Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/011955
Kind Code:
A1
Abstract:
A semiconductor device comprises multiple memory chips (100) and a temperature detection module (110). The temperature detection module (110) comprises: multiple temperature detection units (111) disposed on at least a portion of the memory chips (100), so as to detect the temperature of the portion of the memory chips (100); and a processing unit (112), wherein the multiple temperature detection units (111) share the processing unit (112), and the processing unit (112) is used to process a signal of at least one of the temperature detection units (111). The temperature detection module (110) is used to detect the temperature of the memory chips (100), and the temperature detected by the temperature detection module (110) provides reference information for start-up and operations of the memory chips (100), thereby preventing the memory chips (100) from starting or operating at a low temperature, reducing writing time, and improving writing stability of the memory chips (100). In addition, the temperature detection module (110) has a simple circuit structure and is easy to implement, and the temperature detection units (111) share the processing unit (112), such that the temperature detection module (110) occupies a small area without affecting the effective area of the memory chips (100).
Inventors:
NING SHULIANG (CN)
Application Number:
PCT/CN2020/136390
Publication Date:
January 20, 2022
Filing Date:
December 15, 2020
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C7/04; G01K15/00; G11C11/407
Foreign References:
| CN110299171A | 2019-10-01 | |||
| CN212303078U | 2021-01-05 | |||
| CN212303077U | 2021-01-05 | |||
| CN101162604A | 2008-04-16 | |||
| US20110279168A1 | 2011-11-17 |
Attorney, Agent or Firm:
SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)
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