Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/059597
Kind Code:
A1
Abstract:
A semiconductor device (1) comprises: a semiconductor layer (10) having a main surface (11); a switching element (2) formed in the semiconductor layer; a first electrode (50) disposed on the main surface and electrically connected to the switching element; a second electrode (55) disposed on the main surface at an interval from the first electrode, and electrically connected to the switching element; a first terminal electrode (70) including a portion overlapping the first electrode and a portion overlapping the second electrode in plan view, and electrically connected to the first electrode; and a second terminal electrode (75) including a portion overlapping the second electrode in plan view, and electrically connected to the second electrode.
Inventors:
HIKASA AKIHIRO (JP)
Application Number:
PCT/JP2021/033188
Publication Date:
March 24, 2022
Filing Date:
September 09, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/78; H01L21/28; H01L21/3205; H01L21/336; H01L21/768; H01L23/522; H01L29/12; H01L29/41; H01L29/739; H01L29/861; H01L29/868
Domestic Patent References:
| WO2019106948A1 | 2019-06-06 |
Foreign References:
| JP2020080387A | 2020-05-28 | |||
| US20100320461A1 | 2010-12-23 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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