Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/085068
Kind Code:
A1
Abstract:
Provided is a semiconductor device with which the coupling state of an object to be joined and a terminal is improved. This semiconductor device includes an object to be joined, a case, and a terminal. The object to be joined includes a metallic pattern. The case includes a frame and accommodates the object to be joined inside the frame. The terminal includes a first end and a second end. The first end is joined to the metallic pattern of the object to be joined. The second end is drawn out of the case from the first end. The object to be joined is an insulating substrate or a semiconductor element held on the insulating substrate. The case includes a beam that crosses a space inside the frame. The beam holds a part of the terminal between the first end and the second end.
Inventors:
SAKAI YASUHIRO (JP)
Application Number:
PCT/JP2020/039388
Publication Date:
April 28, 2022
Filing Date:
October 20, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/04; H01L25/07; H01L25/18
Foreign References:
| JP2018006697A | 2018-01-11 | |||
| JP2009200416A | 2009-09-03 | |||
| JP2019067885A | 2019-04-25 | |||
| JP2003249624A | 2003-09-05 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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