Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/244065
Kind Code:
A1
Abstract:
This semiconductor device (100) comprises a semiconductor element (1), an insulating substrate (5) on which the semiconductor element (1) is mounted, a heat dissipating part (9) on which the insulating substrate (5) is stacked, and a bonding part (6) for bonding the insulating substrate (5) and the heat dissipating part (9). The bonding part (6) includes an adhesive (7) and a net-like member (8) having a coefficient of linear expansion lower than that of the adhesive (7) and provided with through-holes. In the direction in which the insulating substrate (5) is stacked on the heat dissipating part (9), the center of the thickness of the net-like member (8) is positioned further toward the insulating substrate (5) than the center of the thickness of the bonding part (6).
Inventors:
KAWANISHI KATSUNORI (JP)
KITAGAWA TATSUYA (JP)
UEGAKI SHIN (JP)
KITAGAWA TATSUYA (JP)
UEGAKI SHIN (JP)
Application Number:
PCT/JP2021/018627
Publication Date:
November 24, 2022
Filing Date:
May 17, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36
Foreign References:
| JPH01130592U | 1989-09-05 | |||
| JP2015043356A | 2015-03-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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