Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/255048
Kind Code:
A1
Abstract:
A semiconductor device of the present invention comprises: a substrate that has a main surface facing one side in the thickness direction; a plurality of semiconductor elements that are positioned at the one side in the thickness direction with respect to the substrate, and have a switching function; in the thickness direction, a first layer that is positioned between the main surface and the plurality of semiconductor elements, and that is electrically conductive; a second layer that conductively joins the main surface and the first layer; and a third layer that conductively joins the first layer and the plurality of semiconductor elements.
Inventors:
TAKAHASHI SOICHIRO (JP)
Application Number:
PCT/JP2022/019913
Publication Date:
December 08, 2022
Filing Date:
May 11, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/12; H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| WO2010087432A1 | 2010-08-05 | |||
| WO2019189612A1 | 2019-10-03 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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