Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/100663
Kind Code:
A1
Abstract:
This semiconductor device is provided with a semiconductor element, a conductive member, and a sealing resin. The conductive member comprises a die pad section, a first terminal section, and a second terminal section. The sealing resin covers part of the conductive member, and the semiconductor element. The sealing resin has a first resin surface, a second resin surface, a third resin surface, and a fourth resin surface. The die pad section has a first lead principal surface where the semiconductor element is mounted, and a first lead reverse surface exposed from the second resin surface. The first terminal section is bent to one side in the z-direction, and is exposed from the third resin surface. The second terminal section is bent to one side in the z-direction, and is exposed from the fourth resin surface. The first resin surface has a concave shape region that is recessed toward the second resin surface side in the z-direction. The concave shape region overlaps with an imaginary line segment linking the first terminal section and the second terminal section as seen in the z-direction.
Inventors:
KAKIZAKI RYOTARO (JP)
SAITO KOSHUN (JP)
SAITO KOSHUN (JP)
Application Number:
PCT/JP2022/042650
Publication Date:
June 08, 2023
Filing Date:
November 17, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48
Foreign References:
| JPH0312954A | 1991-01-21 | |||
| JPH01174956U | 1989-12-13 | |||
| JP2010212736A | 2010-09-24 | |||
| JP2021141209A | 2021-09-16 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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