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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145329
Kind Code:
A1
Abstract:
Provided is a semiconductor device that can quickly detect, with good precision, positional displacement of a first semiconductor structure and a second semiconductor structure while suppressing the enlargement of the first and the second semiconductor structures. This semiconductor device comprises a laminate structure in which the first and the second semiconductor structures are laminated and joined. The first semiconductor structure has a first connection terminal exposed at a first joining surface, which is the joining surface with the second semiconductor structure. The second semiconductor structure has a second connection terminal that is exposed at a second joining surface, which is the joining surface with the first semiconductor structure, and that is joined to the first connection terminal. The laminate structure includes at least one of: a first electrode that is provided to the first semiconductor structure and that has an electrical characteristic, relative to the second semiconductor structure, which can be changed in correspondence to the positional displacement of the first and the second connection terminals; and a second electrode that is provided to the second semiconductor structure and that has an electrical characteristic, relative the first semiconductor structure, which can be changed in correspondence to the positional displacement.

Inventors:
TOMITA MANABU (JP)
NISHIOKA YUTA (JP)
Application Number:
PCT/JP2022/047287
Publication Date:
August 03, 2023
Filing Date:
December 22, 2022
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18; H01L27/146
Foreign References:
JP2021077776A2021-05-20
JP2019117846A2019-07-18
JP2001291754A2001-10-19
JPH10335401A1998-12-18
JPH1050703A1998-02-20
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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