Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/149257
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a first conductive member; a second conductive member that is at a distance from the first conductive member in a first direction; a first semiconductor element that is bonded to the first conductive member; a second semiconductor element that is bonded to the second conductive member; a third conductive member; a forth conductive member that connects the first semiconductor element to the second conductive member; and a fifth conductive member that connects the second semiconductor element to the third conductive member. The third conductive member comprises a first part that is positioned between the first semiconductor element and the second semiconductor element in the first direction; and the first part faces the first conductive member in the thickness direction. One end of the fifth conductive member is bonded to the first part. The fourth conductive member straddles the first part.
Inventors:
YOSHIHARA KATSUHIKO (JP)
Application Number:
PCT/JP2023/001891
Publication Date:
August 10, 2023
Filing Date:
January 23, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L23/48; H01L25/18
Domestic Patent References:
| WO2021176996A1 | 2021-09-10 |
Foreign References:
| JP2020504459A | 2020-02-06 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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