Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/176267
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor element having a plurality of electrodes; a first lead having a first pad portion and a first terminal portion, a second lead having a second pad portion and a second terminal; a plurality of wires; and a sealing resin. The plurality of wires are individually conductively joined to the plurality of electrodes, the first pad portion and the first terminal portion. The length of a straight line connecting the center of the first pad portion and the center of the second pad portion when viewed in a third direction is defined as a first section length. The length of a straight line connecting the center of the first terminal portion and the center of the second terminal portion 322 when viewed in the third direction is defined as a second section length. The second section length is different than the first section length.
Inventors:
ONO TSUNEHISA (JP)
Application Number:
PCT/JP2023/005252
Publication Date:
September 21, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L21/60
Foreign References:
| JP2007305671A | 2007-11-22 | |||
| JPS6010651A | 1985-01-19 | |||
| JP2001326295A | 2001-11-22 | |||
| JP2009032767A | 2009-02-12 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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