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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/214500
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention comprises at least one terminal. The terminal includes a cylindrical holder having conductivity, and a metal pin inserted into the holder. The semiconductor device further comprises a terminal support that supports the holder, and a sealing resin that covers the terminal support and a portion of the holder. The sealing resin has a resin main surface facing one side in the thickness direction. The holder has a first surface positioned at an edge thereof on one side in the thickness direction, and a first outer side surface extending in the thickness direction. The first surface is at a position different from the resin main surface in the thickness direction. The first outer side surface is in contact with the sealing resin. The metal pin protrudes further to one side in the thickness direction than the resin main surface.

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Inventors:
TANIKAWA KOHEI (JP)
IKEDA DAIKI (JP)
Application Number:
PCT/JP2023/015070
Publication Date:
November 09, 2023
Filing Date:
April 13, 2023
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/28; H01L23/29; H01L23/31; H01L23/48; H01L25/18
Domestic Patent References:
WO2022080063A12022-04-21
Foreign References:
JP2011165836A2011-08-25
JP2014123618A2014-07-03
JP2007184315A2007-07-19
US20190115275A12019-04-18
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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