Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/223843
Kind Code:
A1
Abstract:
This semiconductor device comprises a first wire, a first semiconductor element having an electrode electrically connected to the first wire, and a bump conductively joined to the electrode. The first wire includes a first joint portion positioned at one end, and a second joint portion positioned at the other end. The bump includes a disc portion contacting the electrode, and a column portion protruding from the disc portion in a first direction. The second joint portion is conductively joined to the column portion. The size of the column portion in the first direction increases toward the first joint portion.
Inventors:
MATSUBARA HIROAKI (JP)
Application Number:
PCT/JP2023/017144
Publication Date:
November 23, 2023
Filing Date:
May 02, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| JP2004281488A | 2004-10-07 | |||
| JP2016207714A | 2016-12-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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