Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/224113
Kind Code:
A1
Abstract:
This semiconductor device comprises: a first switching element; a first primary connection member; and a first secondary connection member. The first switching element includes a first electrode which is disposed on a first side in the thickness direction and through which a primary current flows. The first primary connection member and the first secondary connection member are connected to the first electrode. The first primary connection member mainly comprises a first primary metal, and the first secondary connection member mainly comprises a first secondary metal. The first primary metal and the first secondary metal are mutually different.
Inventors:
UMEGAMI HIROKATSU (JP)
SAKAI HIROTO (JP)
YOSHIHARA KATSUHIKO (JP)
OTSUKA TAKUKAZU (JP)
SAKAI HIROTO (JP)
YOSHIHARA KATSUHIKO (JP)
OTSUKA TAKUKAZU (JP)
Application Number:
PCT/JP2023/018706
Publication Date:
November 23, 2023
Filing Date:
May 19, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60; H01L25/07; H01L25/18; H01L29/41; H01L29/417
Domestic Patent References:
| WO2015190559A1 | 2015-12-17 |
Foreign References:
| JP2020092108A | 2020-06-11 | |||
| JP2018022849A | 2018-02-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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