Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243306
Kind Code:
A1
Abstract:
This semiconductor device comprises: a first substrate having a first main surface; a first main surface conductive part disposed on the first main surface; a second substrate having a second main surface; a second main surface conductive part disposed on the second main surface; a switching element disposed on the first main surface and conductively connected to the first main surface conductive part; a driving device that is disposed on the second main surface and conductively connected to the second main surface conductive part, and that drives the switching element; and a sealing resin that covers at least part of the first substrate and the second substrate, and the entirety of the switching element and the driving device.
Inventors:
MATSUO MASAAKI (JP)
INOUE KAITO (JP)
HARA HIDEO (JP)
INOUE KAITO (JP)
HARA HIDEO (JP)
Application Number:
PCT/JP2023/018745
Publication Date:
December 21, 2023
Filing Date:
May 19, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/58; H01L25/18
Domestic Patent References:
| WO2014064822A1 | 2014-05-01 | |||
| WO2015174198A1 | 2015-11-19 |
Foreign References:
| JPH098223A | 1997-01-10 | |||
| JP2013058726A | 2013-03-28 | |||
| JP2013074254A | 2013-04-22 | |||
| JP2022053848A | 2022-04-06 | |||
| JP2011054625A | 2011-03-17 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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