Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276943
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, a first lead that conducts to the semiconductor element, and a connection member that is connected to the semiconductor element and the first lead. The connection member includes a core section including a first material, and a surface section. The surface section includes a first metal, and covers the core section. The first material includes an alloy resulting from adding at least a third metal to a second metal, and has a higher corrosion resistance than the second metal. The third metal has the highest composition ratio among the added metal or metals, and has a higher atomic number than the second metal.
Inventors:
UEBAYASHI KAORI (JP)
MITA MAKI (JP)
MITA MAKI (JP)
Application Number:
PCT/JP2022/025550
Publication Date:
January 05, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| JP2018078229A | 2018-05-17 | |||
| JP5912008B1 | 2016-04-27 | |||
| JP2011003745A | 2011-01-06 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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