Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024415
Kind Code:
A1
Abstract:
This semiconductor device comprises: a field plate which is disposed on a semiconductor layer between a drain region and a source/gate region, and which is spirally wound a plurality of times in a plan view, the field plate being resistive and including an inner-most peripheral portion electrically connected to the drain region, and an outer-most peripheral portion electrically connected to ground; and a voltage-dividing wire of which one end portion is electrically connected to a resistive voltage-dividing portion that is set in an intermediate position between the inner-most peripheral portion and the outer-most peripheral portion of the field plate.
Inventors:
TERADA CHIKARA (JP)
FUJIE SHUSAKU (JP)
FUJIE SHUSAKU (JP)
Application Number:
PCT/JP2023/024767
Publication Date:
February 01, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/808; H01L21/28; H01L21/337; H01L21/338; H01L21/822; H01L27/04; H01L29/06; H01L29/41; H01L29/812
Foreign References:
| JP2017208420A | 2017-11-24 | |||
| JP2016096176A | 2016-05-26 | |||
| JP2008153636A | 2008-07-03 | |||
| JP2022169975A | 2022-11-10 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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