Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/038736
Kind Code:
A1
Abstract:
This semiconductor device comprises a first lead having a die pad portion, a first semiconductor element mounted on the die pad portion, and a plurality of second leads. The plurality of second leads are arrayed, on one side in a first direction orthogonal to the thickness direction of the die pad portion, along a second direction orthogonal to the thickness direction and the first direction. The die pad portion comprises a die pad main surface facing one side in the thickness direction. The center of the first semiconductor element when viewed in the thickness direction is displaced from the center in the second direction of the die pad main surface. Each of the plurality of second leads comprises a second pad portion extending toward the first semiconductor element when viewed in the thickness direction.
Inventors:
SHIRAI KATSUTOKI (JP)
Application Number:
PCT/JP2023/027137
Publication Date:
February 22, 2024
Filing Date:
July 25, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| WO2022145177A1 | 2022-07-07 |
Foreign References:
| JP2018107416A | 2018-07-05 | |||
| JP2012109435A | 2012-06-07 | |||
| JP2022055599A | 2022-04-08 | |||
| US20150332992A1 | 2015-11-19 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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