Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/043001
Kind Code:
A1
Abstract:
A semiconductor device including a semiconductor substrate having a first surface on which a first electrode is disposed, a first semiconductor region, of a first conductivity type, disposed on a second surface of the semiconductor substrate, a plurality of second semiconductor regions, of a second conductivity type, disposed on the first semiconductor region and extending along a first direction, a third semiconductor region, of the second conductivity type, disposed on the first semiconductor region, the third semiconductor region defining a portion of a trench that extends along a second direction that traverses the first direction, a second electrode disposed in the trench, a first insulating film disposed in the trench and between a sidewall of the third semiconductor region defining the portion of the trench and the second electrode, and a fourth semiconductor region, of the first conductivity type, disposed on the third semiconductor region.
Inventors:
IKUTA TETSUYA (JP)
Application Number:
PCT/JP2023/027766
Publication Date:
February 29, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
H01L29/78; H01L29/06; H01L29/10; H01L29/423
Domestic Patent References:
| WO2012108165A1 | 2012-08-16 |
Foreign References:
| US8633539B2 | 2014-01-21 | |||
| US20160043205A1 | 2016-02-11 | |||
| US20190081171A1 | 2019-03-14 | |||
| US20160336443A1 | 2016-11-17 |
Attorney, Agent or Firm:
ITO, Manabu et al. (JP)
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