Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057838
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor element; a first lead that includes a die pad part having a first lead main surface which faces a first side in the thickness direction and on which the semiconductor element is mounted, a first lead back surface which faces the second side in the thickness direction, and a first lead lateral surface which faces a first side in a first direction perpendicular to the thickness direction; a second lead that is provided apart on the first side in the first direction of the die pad; and a wire conductively joined to the semiconductor element and the second lead. The die pad part is further provided with a contact avoidance surface connected to the first lead main surface and the first lead lateral surface. The contact avoidance surface overlaps the wire as viewed in the thickness direction, and is positioned closer to the second side in the thickness direction than the first lead main surface.
Inventors:
KAKIZAKI RYOTARO (JP)
SAITO KOSHUN (JP)
SAITO KOSHUN (JP)
Application Number:
PCT/JP2023/030130
Publication Date:
March 21, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48; H01L23/28
Foreign References:
| JPH0437050A | 1992-02-07 | |||
| JP2017135241A | 2017-08-03 | |||
| JP2011054626A | 2011-03-17 | |||
| US5585667A | 1996-12-17 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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