Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057949
Kind Code:
A1
Abstract:
The present disclosure relates to a semiconductor device that can be individually identified with a simpler configuration. The semiconductor device according to the present disclosure includes a main chip and at least one subchip that is stacked on one surface of the main chip and is smaller in size than the main chip. The subchip includes an ID chip having ID information that is capable of being identified without contact. The present disclosure can be applied to a stacked semiconductor device.
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Inventors:
TAURA TADAYUKI (JP)
Application Number:
PCT/JP2023/031772
Publication Date:
March 21, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/02
Foreign References:
| JP2007088329A | 2007-04-05 | |||
| JP2011108225A | 2011-06-02 | |||
| JPH11261044A | 1999-09-24 | |||
| JP2005005432A | 2005-01-06 | |||
| JPH1126333A | 1999-01-29 | |||
| JP2007005400A | 2007-01-11 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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