Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/062845
Kind Code:
A1
Abstract:
A semiconductor element (40) comprises: an emitter electrode (42) disposed on one surface of a semiconductor substrate (41); and a collector electrode (43) disposed on the reverse surface. The one surface of the semiconductor substrate (41) is provided with a protective film (45) having an opening (451) that exposes the emitter electrode (42) to enable connection. A sintered member (101) is interposed between the emitter electrode (42) and a conductive spacer (70), and connects the emitter electrode (42) and the conductive spacer (70). At least the peripheral portion of the opening (451) among the upper surface (45a) of the protective film (45) is positioned as flush with or lower than the connection surface of the emitter electrode (42) in the Z direction.
Inventors:
ABE EMIKA (JP)
KADOGUCHI TAKUYA (JP)
OKUMURA TOMOMI (JP)
KADOGUCHI TAKUYA (JP)
OKUMURA TOMOMI (JP)
Application Number:
PCT/JP2023/030949
Publication Date:
March 28, 2024
Filing Date:
August 28, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522; H01L25/07; H01L25/18
Domestic Patent References:
| WO2019103028A1 | 2019-05-31 | |||
| WO2016189643A1 | 2016-12-01 |
Foreign References:
| JP2020035812A | 2020-03-05 | |||
| JP2018117054A | 2018-07-26 | |||
| JP2004111885A | 2004-04-08 | |||
| JP2021009869A | 2021-01-28 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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