Title:
SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/039802
Kind Code:
A1
Abstract:
This semiconductor element is provided with a main portion and a rear surface electrode layer. The main portion at least partially comprises a semiconductor, and includes: a main surface and a rear surface which face toward mutually opposite sides in the thickness direction; a main-surface-side first side surface which is orthogonal to a first direction that is orthogonal to the thickness direction, and which is joined to the main surface; and a rear-surface-side first side surface which faces toward the same side as the main-surface-side first side surface, and which is joined to the rear surface. The rear surface electrode layer covers at least a portion of the rear surface of the main portion. The rear-surface-side first side surface is positioned to the outside of the main-surface-side first side surface in the first direction. The rear surface electrode layer is provided with a first elongated portion which covers at least a portion of the rear-surface-side first side surface.
Inventors:
YAMAJI HIDEAKI (JP)
Application Number:
PCT/JP2020/032062
Publication Date:
March 04, 2021
Filing Date:
August 25, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
B23K26/364; B23K26/38; H01L21/301
Foreign References:
| JP2018078162A | 2018-05-17 | |||
| JP2018078192A | 2018-05-17 | |||
| JP2017228651A | 2017-12-28 | |||
| JPH0927639A | 1997-01-28 | |||
| JPS6195544A | 1986-05-14 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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