Title:
SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/006991
Kind Code:
A3
Abstract:
The invention relates to a semiconductor element having at least one semiconductor chip (2), two contacting layers (5, 6) which are arranged on two faces (3, 4) of the semiconductor and cover at least sections of the faces of the semiconductor chip, and further having a metal body (7, 8) which is associated with a first face of the semiconductor chip at a distance, said metal body being connected to the semiconductor chip in a thermally and electrically conducting manner via finger-type connecting webs (9) that project from the contacting layer associated with the first face. The finger-type connecting webs are interspaced from each other and the finger-type connecting webs are monolithically connected to the contacting layer.
Inventors:
BRAGARD MICHAEL (DE)
DE DONCKER RIK (BE)
MURA FLORIAN (DE)
DICK CHRISTIAN (DE)
DE DONCKER RIK (BE)
MURA FLORIAN (DE)
DICK CHRISTIAN (DE)
Application Number:
PCT/DE2011/001173
Publication Date:
May 31, 2012
Filing Date:
May 30, 2011
Export Citation:
Assignee:
RWTH AACHEN (DE)
BRAGARD MICHAEL (DE)
DE DONCKER RIK (BE)
MURA FLORIAN (DE)
DICK CHRISTIAN (DE)
BRAGARD MICHAEL (DE)
DE DONCKER RIK (BE)
MURA FLORIAN (DE)
DICK CHRISTIAN (DE)
International Classes:
H01L23/367; H01L21/48; H01L23/492
Foreign References:
| US20030211657A1 | 2003-11-13 | |||
| US20090316360A1 | 2009-12-24 | |||
| EP2061078A1 | 2009-05-20 | |||
| US5510650A | 1996-04-23 |
Other References:
See also references of EP 2577725A2
Attorney, Agent or Firm:
FIEDLER, OSTERMANN & SCHNEIDER (Paderborn, DE)
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