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Title:
SEMICONDUCTOR LASER DEVICE AND PRODUCTION METHOD THEREOF, AND METHOD OF CONNECTION BETWEEN SEMICONDUCTOR LASER DEVICE AND OPTICAL WAVEGUIDE
Document Type and Number:
WIPO Patent Application WO/2004/093273
Kind Code:
A1
Abstract:
This invention provides a semiconductor laser device 21 which can be accurately and easily connected to an optical waveguide device 22, a method of producing the semiconductor laser device 21, and a method for accurately and easily connecting the semiconductor laser device 21 to the optical waveguide device 22. In the semiconductor laser device 21 according to the present invention, a light emission portion 2a of the semiconductor device 21 is equipped with stripe-like grooves 9 for reference which can be accurately and easily grasped. In the production method of the semiconductor laser device 21 of the present invention, the stripe-like light emission portion 2a, a stripe-like light non-emission portion 2b and the stripe-like grooves 9 for reference are formed on a semiconductor substrate 1. The connection method of the semiconductor laser device 21 and the optical waveguide device 22 according to the present invention optically couples the light emission portion 2a of the semiconductor laser device and the optical waveguide device 2b with the stripe-like grooves 9 for reference being the reference.

Application Number:
PCT/JP1994/001277
Publication Date:
October 28, 2004
Filing Date:
August 03, 1994
Export Citation:
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Assignee:
IWASE MASAYUKI (JP)
International Classes:
G02B6/42; H01S5/00; H01S5/022; H01S5/042; H01S5/22; H01S5/227; H01S5/40; (IPC1-7): H01S3/18
Foreign References:
JPH02171709A1990-07-03
JPS51108573U1976-08-31
JPS59107590A1984-06-21
Attorney, Agent or Firm:
Saito, Yoshio (6-6 Yurakucho 1-chom, Chiyoda-ku Tokyo 100, JP)
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