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Patent Searching and Data


Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/089949
Kind Code:
A1
Abstract:
The present invention comprises: a wiring substrate in which a p electrode and an n electrode are provided on a substrate; a light emitting functional layer which includes a p-type semiconductor layer and a n-type semiconductor layer that are connected to the p electrode and the n electrode and which is affixed onto the wiring substrate; a light-transmitting optical element which is provided to a side surface of a light-transmitting optical body that has a plate-like shape, and which has a light-blocking film that covers a peripheral part of the rear surface of the light-transmitting optical body and that has an annular frame body part formed on a peripheral part; and an adhesive layer which adheres the light-transmitting optical element to the upper surface of the wiring substrate such that the light emitting functional layer is inserted into a recess inward of the frame body part. The inside of the recess is filled with the adhesive layer.

Inventors:
KONO KEIMA (JP)
ICHIKAWA KOJI (JP)
KAMBARA DAIZO (JP)
HORIO NAOCHIKA (JP)
Application Number:
PCT/JP2022/035167
Publication Date:
May 25, 2023
Filing Date:
September 21, 2022
Export Citation:
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Assignee:
STANLEY ELECTRIC CO LTD (JP)
International Classes:
H01L33/58; H01L33/50
Domestic Patent References:
WO2021100454A12021-05-27
Foreign References:
JP2019145690A2019-08-29
JP2010219324A2010-09-30
JP2015090886A2015-05-11
KR20200134466A2020-12-02
JP2015225862A2015-12-14
JP2015119063A2015-06-25
JP2010219324A2010-09-30
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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