SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE COMPRISING SAME

WIPO Patent Application WO/2021/256574

A1

An embodiment relates to a semiconductor light-emitting device package and a display device comprising same. A semiconductor light-emitting device package according to an embodiment may comprise: a light-emitting structure (155) including a first conductive type semiconductor layer (155a), an active layer (155b), and a second conductive type semiconductor layer (155c); a first electrode (151) and a second electrode (152) that are electrically connected to the first conductive type semiconductor layer (155a) and the second conductive type semiconductor layer (155c) of the light-emitting structure (155), respectively; an interlayer insulating layer disposed on the side surfaces of the light-emitting structure (155); and an adhesive layer (158) disposed on the light-emitting structure (155). The first electrode (151) comprises a first reflective electrode (151a) and a first pad electrode (151b), and the second electrode (152) also comprises a second reflective electrode (152a) and a second pad electrode (152b), wherein the cross-sectional shape of the first reflective electrode (151a) and the second reflective electrode (152a) may be a cup shape.

JP2011114341	LIGHT EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME
JP4673610	Surface mount light emitting diode

CHOI BONGSEOK (KR)
PARK SUNGJIN (KR)
MOON JOONKWON (KR)
OH TAESU (KR)

PCT/KR2020/007732

December 23, 2021

June 15, 2020

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LG ELECTRONICS INC (KR)

H01L33/48; H01L25/075; H01L27/15

KR20200011964A	2020-02-04
KR20100046558A	2010-05-07
JP2006332320A	2006-12-07
KR20200046223A	2020-05-07
US20160336489A1	2016-11-17

HAW, Yong Noke (KR)

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