Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING UNIT
Document Type and Number:
WIPO Patent Application WO/2023/100887
Kind Code:
A1
Abstract:
This semiconductor light emitting device comprises: a substrate that has a substrate front surface, a substrate back surface on the reverse side from the substrate front surface, and substrate lateral surfaces; front-surface-side wiring that is formed on the substrate front surface; back-surface-side wiring that is formed on the substrate back surface; and a semiconductor light emitting element that has a light emitting element lateral surface as a light emitting surface which emits light in a prescribed direction, and that is mounted to the front-surface-side wiring. The substrate lateral surfaces include a first substrate lateral surface which faces the same side as the light emitting element lateral surface that is a light emitting surface, and a second substrate lateral surface on the reverse side from the first substrate lateral surface. The semiconductor light emitting element is disposed so as to be offset more toward the first substrate lateral surface than the second substrate lateral surface. Provided to the first substrate lateral surface is an end surface through hole which passes through the substrate in the thickness direction of the substrate and which connects the front-surface-side wiring and the back-surface-side wiring.
Inventors:
SAKAMOTO KOKI (JP)
Application Number:
PCT/JP2022/044005
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01S5/02315; H01S5/024
Domestic Patent References:
| WO2021014917A1 | 2021-01-28 |
Foreign References:
| JP2005332983A | 2005-12-02 | |||
| JP2012160527A | 2012-08-23 | |||
| US20180278011A1 | 2018-09-27 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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