Title:
SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND WATER DISINFECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/251102
Kind Code:
A1
Abstract:
Provided is a semiconductor light-emitting device having high hermetic reliability provided by increasing the reliability of bonding between a substrate and a lid. A first joint pattern (6) made of metal is formed on a substrate (1) so as to surround a semiconductor light-emitting element. A second joint pattern (5) of a shape corresponding to the first joint pattern (6) is provided on a base portion (4c) and a flange portion (4b) of a domed transparent body. The first and second joint patterns (5, 6) are joined with solder and seal the space inside a convex lid portion (4a). The first and second joint patterns (5, 6) when viewed from above have a rectangular-ring shape surrounding the semiconductor light-emitting element, and include: corner portions (51, 61) having at least an inner-peripheral edge thereof positioned outside an outer peripheral edge of an annular base portion (4c) of the convex lid portion (4a); and straight portions (52, 62) disposed between the corner portions (51, 61) and having an inner-peripheral edge positioned on the semiconductor light-emitting element side of the outer peripheral edge of the annular base portion (4c) of the convex lid portion (4a).
Inventors:
KIRAI SHOGO (JP)
YAMANE TAKAYOSHI (JP)
SAITO CHIZU (JP)
YAMANE TAKAYOSHI (JP)
SAITO CHIZU (JP)
Application Number:
PCT/JP2021/019263
Publication Date:
December 16, 2021
Filing Date:
May 20, 2021
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD (JP)
International Classes:
H01L33/48; H01S5/02208; H01S5/02218
Foreign References:
| JP2016127255A | 2016-07-11 | |||
| JP2006093372A | 2006-04-06 | |||
| JP2018509290A | 2018-04-05 | |||
| JP2018037581A | 2018-03-08 | |||
| JP2017216389A | 2017-12-07 | |||
| US20170162767A1 | 2017-06-08 |
Attorney, Agent or Firm:
Sannozaka Patent Law Firm (JP)
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