Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157800
Kind Code:
A1
Abstract:
The present invention comprises a light-emitting element assembly including: a semiconductor light-emitting element having a support substrate having a first electrode and a second electrode on the bottom surface thereof, and a light-emitting semiconductor layer provided on the supporting substrate and connected to the first electrode and the second electrode; and a light guide adhered to a light emission surface of the semiconductor light-emitting element by using an adhesive layer. The present invention also comprises a cylindrical heat-shrinking cover member comprising a heat-shrinking resin which covers side surfaces of the light-emitting element assembly.
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Inventors:
KONO KEIMA (JP)
ICHIKAWA KOJI (JP)
KAMBARA DAIZO (JP)
HORIO NAOCHIKA (JP)
ICHIKAWA KOJI (JP)
KAMBARA DAIZO (JP)
HORIO NAOCHIKA (JP)
Application Number:
PCT/JP2023/004770
Publication Date:
August 24, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD (JP)
International Classes:
H01L33/48; H01L33/50; H01L33/56; H01L33/62
Domestic Patent References:
| WO2016190207A1 | 2016-12-01 |
Foreign References:
| JP2017510997A | 2017-04-13 | |||
| JP2013505571A | 2013-02-14 | |||
| JP2020025089A | 2020-02-13 | |||
| JP2008300580A | 2008-12-11 | |||
| JPH0721807A | 1995-01-24 | |||
| CN103258941A | 2013-08-21 | |||
| CN110690336A | 2020-01-14 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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