Title:
SEMICONDUCTOR LIGHT EMITTING ELEMENT, HEADLAMP DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/145656
Kind Code:
A1
Abstract:
An insulating portion (12) partitions a p-type semiconductor layer (111), an n-type semiconductor layer (112), and a light emitting layer (113), which are arrayed in a first direction, into a first region (R1) and a second region (R2) that are electrically insulated from each other. A light transmissive layer (13) has a monolithic structure spanning across the first region (R1) and the second region (R2), and permits transmission of light emitted from the light emitting layer (113). A first conductive portion (141) is electrically connected to the n-type semiconductor layer (112) in the first region (R1). A second conductive portion (142) electrically connects the p-type semiconductor layer (111) in the first region (R1) and the n-type semiconductor layer (112) in the second region (R2). A third conductive portion (143) is electrically connected to the p-type semiconductor layer (111) in the second region (R2). The area of the first region (R1) viewed from the first direction is smaller than the area of the second region (R2) viewed from the first direction.
Inventors:
TSUKAMOTO HIRONORI (JP)
MATSUDA SHUHEI (JP)
MAENO YUZO (JP)
NAKAGAWA TOMOYUKI (JP)
NAITO RYOTA (JP)
ITO TAKASHI (JP)
MATSUDA SHUHEI (JP)
MAENO YUZO (JP)
NAKAGAWA TOMOYUKI (JP)
NAITO RYOTA (JP)
ITO TAKASHI (JP)
Application Number:
PCT/JP2023/001782
Publication Date:
August 03, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
KOITO MFG CO LTD (JP)
International Classes:
H01L33/08; F21S41/141; F21S41/143; F21S41/147; F21S41/148; F21S41/25; F21S41/30; H01L33/48; H01L33/50; H01L33/58; F21W102/13; F21W102/155; F21Y115/10; F21Y115/20; F21Y115/30
Domestic Patent References:
| WO2019176622A1 | 2019-09-19 | |||
| WO2006025261A1 | 2006-03-09 |
Foreign References:
| JP2011134829A | 2011-07-07 | |||
| JP2009531839A | 2009-09-03 | |||
| US20200025351A1 | 2020-01-23 | |||
| JP2018190896A | 2018-11-29 | |||
| JP2017109686A | 2017-06-22 | |||
| JP2013239673A | 2013-11-28 | |||
| JP2008078225A | 2008-04-03 |
Attorney, Agent or Firm:
SHIN-EI, P.C. (JP)
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