Title:
SEMICONDUCTOR LIGHT-RECEIVING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/233718
Kind Code:
A1
Abstract:
In the present invention, a semiconductor light-receiving element (1) comprises: a substrate (10); and a semiconductor laminated portion (20) that is formed on the substrate (10), said semiconductor laminated portion (20) including a rear surface (10b) that is on the substrate (10) side, a front surface (10a) that is on the opposite side from the substrate (10), and a side surface (20s) that extends from the rear surface (10b) toward the front surface (10a). The semiconductor laminated portion (20) includes: a light-absorbing layer (23) of a first conductivity type, the light-absorbing layer including InxGa1-xAs; optical waveguide layers (21, 22) of the first conductivity type, the optical waveguide layers being provided between the substrate (10) and the light-absorbing layer (23); and a first semiconductor layer (24) of a second conductivity type that differs from the first conductivity type, the first semiconductor layer (24) being positioned on the opposite side from the substrate (10) relative to the light-absorbing layer (23) and being joined to the light-absorbing layer (23). The In composition x in the light-absorbing layer (23) is at least 0.55, the thickness of the light-absorbing layer (23) is 1.8 µm or less, the semiconductor light-receiving element is of a side surface-entry type in which the light enters from the side surface (20s), and light that enters from the side surface (20s) reaches the light-absorbing layer (23) via the optical waveguide layers (21, 22).
Inventors:
TAGUCHI KEIKI (JP)
MAKINO KENJI (JP)
OHSHIGE YOSHIAKI (JP)
ISHIHARA HAJIME (JP)
MAKINO KENJI (JP)
OHSHIGE YOSHIAKI (JP)
ISHIHARA HAJIME (JP)
Application Number:
PCT/JP2023/005251
Publication Date:
December 07, 2023
Filing Date:
February 15, 2023
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L31/10
Foreign References:
JP2004247620A | 2004-09-02 | |||
JP2005039269A | 2005-02-10 | |||
JP2004146408A | 2004-05-20 | |||
JPH09148616A | 1997-06-06 | |||
JP2019197794A | 2019-11-14 | |||
JP2006229156A | 2006-08-31 | |||
JP2009531847A | 2009-09-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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