Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR MANUFACTURING APPARATUS AND COMPONENT FOR SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/202364
Kind Code:
A1
Abstract:
Provided is a semiconductor manufacturing apparatus comprising: a processing chamber; a substrate support unit provided in the processing chamber to hold a substrate; a plate opposing the substrate support unit and having a gas inlet; and a cylindrical member supporting the plate and surrounding the substrate. The plate and the cylindrical member are components of an SiC member having an SiC film formed by CVD. The cylindrical member has a first portion which is deformable in response to a load.

More Like This:
JPS6396937SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
JP2008536296Plasma oxidation and removal of oxidizing materials
JP2007183168METHOD FOR ESTIMATING ETCHING DEPTH AND METHOD FOR EVALUATING ELEMENT CONCENTRATION DISTRIBUTION
Inventors:
SATOH NAOYUKI (JP)
Application Number:
PCT/JP2022/010604
Publication Date:
September 29, 2022
Filing Date:
March 10, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; C23C16/42; C23C16/44; H01L21/31
Foreign References:
JP2020506291A2020-02-27
JPH1087376A1998-04-07
JP6550198B12019-07-24
JPH08172080A1996-07-02
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: INSULATION FILM-PROVIDED FLAT CONDUCTIVE PLATE AND METHOD FOR MANUFACTURING SAME

Next Patent: INSPECTION ASSISTANCE SYSTEM, INSPECTION ASSISTANCE METHOD, AND PROGRAM