Title:
SEMICONDUCTOR MANUFACTURING DEVICE MEMBER AND ELECTROSTATIC CHUCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004778
Kind Code:
A1
Abstract:
This semiconductor manufacturing device member includes a pair of ceramic plates and an internal electrode which is sandwiched by the pair of ceramic plates. A metal plate is a material for the internal electrode. A diffusion layer is formed at a section of the ceramic plates which contacts the internal electrode, and metal atoms contained in the metal plate material are diffused in the diffusion layer.
Inventors:
HIDAKA NOBUHIRO (JP)
MIURA YUKIO (JP)
ARIKAWA JUN (JP)
YOSHIOKA YOSHIKI (JP)
MIURA YUKIO (JP)
ARIKAWA JUN (JP)
YOSHIOKA YOSHIKI (JP)
Application Number:
PCT/JP2023/022915
Publication Date:
January 04, 2024
Filing Date:
June 21, 2023
Export Citation:
Assignee:
SUMITOMO OSAKA CEMENT CO LTD (JP)
International Classes:
H01L21/683; C23C16/458; H01L21/205; H01L21/3065
Domestic Patent References:
| WO2017131159A1 | 2017-08-03 |
Foreign References:
| JPH10242256A | 1998-09-11 | |||
| JPH02206147A | 1990-08-15 | |||
| JPH11312729A | 1999-11-09 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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