SEMICONDUCTOR MANUFACTURING EQUIPMENT - SEMICONDUCTOR PROCESS LAB CO

Title:

SEMICONDUCTOR MANUFACTURING EQUIPMENT

Document Type and Number:

WIPO Patent Application WO/1992/015116

Kind Code:

A1

Abstract:

Semiconductor manufacturing equipment having a plurality of treatment sections, simultaneously or continuously performing film forming and etching, and making it possible to feed treatment gas for film forming and etching to each treatment section from one gas feed source and perform uniform wafer treatment by each treatment section; which includes a treatment gas feed source (9) for feeding treatment gas, a plurality of branch pipes (19a to 19e) branched from a sending pipe (18) connected with the treatment gas feed source (9), a plurality of intake pipes (20a to 20e) connected between the branch pipes (19a to 19e) and the treatment sections (27a to 27e) through first flow regulating means (25a to 25e), a plurality of exhaust pipes (21a to 21e) connected to the branch pipes (19a to 19e), selecting means (24a to 24e) for selectively flowing treatment gas through the intake pipes (20a to 20e) or the exhaust pipes (21a to 21e), and second flow regulating means (26a to 26e) formed on the exhaust pipes (21a to 21e). This equipment is useful as a CVD system or etching system having a plurality of treatment sections such as a multichamber.

Inventors:

MAEDA KAZUO (JP)
OHIRA KOUICHI (JP)
HIROSE MITSUO (JP)

Application Number:

PCT/JP1992/000137

Publication Date:

September 03, 1992

Filing Date:

February 12, 1992

Export Citation:

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Assignee:

SEMICONDUCTOR PROCESS LAB CO (JP)
CANON SALES CO INC (JP)
ALCAN TECH CO INC (JP)

International Classes:

B01J12/00; B01J4/00; C23C16/44; C23C16/455; H01L21/00; H01L21/205; H01L21/316; (IPC1-7): H01L21/31

Foreign References:

JPS5176976A	1976-07-03
JPS6447872A	1989-02-22

Other References: