Title:
SEMICONDUCTOR MEMORY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/079851
Kind Code:
A1
Abstract:
A semiconductor memory device according to an embodiment of the present invention includes: a first chip including a first pillar having a first memory cell and a second memory cell connected in series; a second chip including a second pillar having a third memory cell and a fourth memory cell connected in series; and a third chip including a row decoder to which each of a first word line connected to a gate of the first memory cell, a second word line connected to a gate of the third memory cell, and a third word line connected to gates of the second memory cell and the fourth memory cell are connected.
Inventors:
HOSONO KOJI (JP)
Application Number:
PCT/JP2022/038255
Publication Date:
April 18, 2024
Filing Date:
October 13, 2022
Export Citation:
Assignee:
KIOXIA CORP (JP)
International Classes:
H10B43/27; H01L21/336; H01L29/788; H01L29/792
Attorney, Agent or Firm:
SUZUYE & SUZUYE (JP)
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