Title:
SEMICONDUCTOR MODULE, SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/249086
Kind Code:
A1
Abstract:
[Solution] A semiconductor chip (1a) provided with a processor (10a), a coil (70a) for wirelessly communicating with another semiconductor chip (1b), a positive electrode power supply terminal (62a), and a negative electrode power supply terminal (61a), wherein, in a material provided with a positive electrode power supply area (52) and a negative electrode power supply area (51): the positive electrode power supply area (52) is bonded or brought into contact with the positive electrode power supply terminal (62a); the negative electrode power supply area (51) is bonded or brought into contact with the negative electrode power supply terminal (61a); the area of at least one of the positive electrode power supply area (52) and the negative electrode power supply area (51) is greater than the area of the end portion of at least one of the positive electrode power supply terminal (62a) and the negative electrode power supply terminal (61a).
Inventors:
TSUJI HIDENORI (JP)
MIYAMOTO JUNTA (JP)
MIYAMOTO JUNTA (JP)
Application Number:
PCT/JP2023/023164
Publication Date:
December 28, 2023
Filing Date:
June 22, 2023
Export Citation:
Assignee:
PREMO INC (JP)
International Classes:
H01L25/04; H01F38/14; H01L21/822; H01L25/18; H01L27/04
Domestic Patent References:
| WO2016157387A1 | 2016-10-06 | |||
| WO2009113373A1 | 2009-09-17 |
Foreign References:
| JP2016144150A | 2016-08-08 | |||
| JP2009027233A | 2009-02-05 | |||
| JP2020115569A | 2020-07-30 |
Attorney, Agent or Firm:
ONE IP PATENT FIRM (JP)
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