Title:
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2023/119837
Kind Code:
A1
Abstract:
A semiconductor module (1) comprises: a laminated substrate (2) having a first circuit board (22) disposed to a top surface of an insulation plate (20); a semiconductor element (3) disposed to a top surface of the first circuit board; a metal wiring board (4) including a first joint portion (40) joined to a top surface of the semiconductor element with a joining material (S) therebetween; and a sealing resin (5) sealing the laminated substrate, the semiconductor element, and the metal wiring board. The first joint portion includes a plate-shaped portion having a top surface and a bottom surface. The metal wiring board comprises: a first rising portion (43) rising upward from one end of the first joint portion; and a second rising portion (44) rising upward from another end of the first joint portion. The first rising portion constitutes a portion of a wiring path along which a main current flows. The second rising portion constitutes a non-wiring path along which the main current does not flow.
Inventors:
SAITO MAI (JP)
NAKAMURA YOKO (JP)
NAKAMURA YOKO (JP)
Application Number:
PCT/JP2022/039305
Publication Date:
June 29, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L23/28; H01L23/48; H01L25/18
Foreign References:
| JP2014216458A | 2014-11-17 | |||
| JP2016018866A | 2016-02-01 | |||
| JP2014228330A | 2014-12-08 | |||
| JP2014216450A | 2014-11-17 | |||
| JP2008041743A | 2008-02-21 | |||
| JP2016092878A | 2016-05-23 |
Attorney, Agent or Firm:
AOKI Hiroyoshi et al. (JP)
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