Title:
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/145667
Kind Code:
A1
Abstract:
Provided is a semiconductor module that includes: a semiconductor element (2) provided with a surface electrode (22); a bonding wire (3) having a junction portion (31) that is joined to the surface electrode (22); a first sealing member (4); and a second sealing member (5). The first sealing member (4) seals the portion where the surface electrode (22) is joined with the bonding wire (3). The second sealing member (5) covers the first sealing member (4). The first sealing member (4) has a greater elasticity than the second sealing member (5).
Inventors:
ITO YUSAKU (JP)
Application Number:
PCT/JP2017/003400
Publication Date:
August 31, 2017
Filing Date:
January 31, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L23/29; H01L23/31; H01L23/48
Foreign References:
| JPH10199923A | 1998-07-31 | |||
| JP2000223623A | 2000-08-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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